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Pickle compound, sodium acid sulfate, niter cake and sodium hydrogen sulfate, for non-ferrous metals. Sold per 2-1/2 pound pkg.

As Low As $4.72 per package

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Item Number: H20-4549BS   Have a question about this item?

Pickle compound removes excess oxidation and flux from soldered pieces. Mix the powder compound with water to produce the non-flammable, non-explosive solution. Heat in the Little Dipper™ Pickle Pot at 140°F (60°C). Use copper tongs to quench soldered pieces to avoid contamination. Mixing directions included.

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